Uniglobe Kisco Represents Meltex Inc. in the Plating Chemicals for Semiconductors Market
Surface Treatment Chemicals for Semiconductor
Formation of Barrier to electrode has become more important for the semiconductor production.
Formation of Barrier by UBM Process through Electroless Plating
Barrier formation through UBM process without resist for electrode less than 10μm by Electroless Ni/Pd/Au.
＊Please be careful that there is possibility of infringement of United State (US) Patent on 3 layer plating with Ni/Pd/Au
Formation of Barrier by Seed Layer Etching
Excellent selectivity properties to etch only the seed layer metal such as Copper and Titanium. Metal bump such as Solder or gold will not be corroded.
