Kiscom High Thermal Conductivity Resin
KISCOM High Thermal Conductivity Resin
KISCOM High Thermal conductivity resin can be molded with normal injection molding machine to making LED bulbs.
Features
- High Heat Dissipation
- Light Weight
- Injection Moldable
- Electrical Insulation
- No Halogen Resin
KISCOM High Brightness LGP
KISCOM High Brightness LGP can be used for LED ceiling light, Signboard, Display applications.
Features
High Brightness- Fine Pitch Prism Patterning
- Less size changes due to water absorbency
- Light Weight
- Applicable to injection molding
Properties
- Light Transmission: 92%
- Refractive Index: 1.55
- Haze: 0.3% (With thickness 3mm)
- Specific Gravity: 1.11
- Water Absorption: 0.09%
KISCOM Ceramic Liquid Materials
Features
- High thermal conductivity (4.4W/mk)
- 3 times High insulation compare with other product (60kV/mm)
- Thermal Resistance (350 degree C)
- High Reflecting
- UV Wavelength (More than 90%) UV Resistance (~254nm UV)
- Heat Resistance (~350 degree C)
- Good Adhesion
Application
- Solder resist on PCBs
- Thermal Interface Materials
- Management of Lighting surge
- Curing condition
- +180 degree C x 30 min
- +300 degree C x 30 min
