Kiscom High Thermal Conductivity Resin

[dt_fancy_title title=”Kiscom High Thermal Conductivity Resin” title_align=”left” title_size=”h3″ title_color=”accent” separator_style=”disabled”]
[dt_fancy_title title=”KISCOM High Thermal Conductivity Resin” title_align=”left” title_size=”h4″ title_color=”custom” separator_style=”disabled” custom_title_color=”#a81313″]

KISCOM High Thermal conductivity resin can be molded with normal injection molding machine to making LED bulbs.

Features

  • High Heat Dissipation
  • Light Weight
  • Injection Moldable
  • Electrical Insulation
  • No Halogen Resin

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[dt_fancy_title title=”KISCOM High Brightness LGP” title_align=”left” title_size=”h4″ title_color=”custom” separator_style=”disabled” custom_title_color=”#a81313″]

KISCOM High Brightness LGP can be used for LED ceiling light, Signboard, Display applications.

Features

  • kisco_high_thermal_conductivity_3High Brightness
  • Fine Pitch Prism Patterning
  • Less size changes due to water absorbency
  • Light Weight
  • Applicable to injection molding

Properties

  • Light Transmission: 92%
  • Refractive Index: 1.55
  • Haze: 0.3% (With thickness 3mm)
  • Specific Gravity: 1.11
  • Water Absorption: 0.09%
[dt_fancy_title title=”KISCOM Ceramic Liquid Materials” title_align=”left” title_size=”h4″ title_color=”custom” separator_style=”disabled” custom_title_color=”#a81313″]

KISCO Ceramic liquid materials which is thermal conductive Insulating coating can be used for LED applications easily.

Features

  • High thermal conductivity (4.4W/mk)
  • 3 times High insulation compare with other product (60kV/mm)
  • Thermal Resistance (350 degree C)
  • High Reflecting
  • UV Wavelength (More than 90%) UV Resistance (~254nm UV)
  • Heat Resistance (~350 degree C)
  • Good Adhesion

Application

  • Solder resist on PCBs
  • Thermal Interface Materials
  • Management of Lighting surge
  • Curing condition
  • +180 degree C x 30 min
  • +300 degree C x 30 min

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