EpiFine Encapsulation

EpiFine – LED Encapsulation

Encapsulation for LEDs

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EpiFine is a two components resin, which is used for encapsulation of LED bullet type and SMD type. It has obtained favorable acceptance for global use.

Difference between Kisco’s EpiFine poduct and other competition is:

  • Water-proof (epecially for outside use) / moisture barrier is better
  • Flexibility is better and therefore it does not crack upon bending

Features

  • Transparency
  • Transmittance
  • Stability against Heat
  • Stability against UV
  • Waterproof
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Epoxy Resin

EpiFine
(Hybrid type)

Silicone Resin


UV
Resistance

EpiFine2 UV Resistance1
UV from chip caused Whitening or yellowing of resin on the top of the die


UV resistance reliability,
kept more than 30,000
hours in accelerated
turning on electrical test


UV resistance reliability ,kept more than 30,000 hours in accelerated turning on electrical test

Flexibility

EpiFine2 Flexibility1
Causes peeling and cracks under heat cycle stress condition

EpiFine2 Flexibility2
Flexibility for
stress relaxation -40 30Min⇔
110 30MIn
100cycles

EpiFine2 Flexibility3
Flexibility for
stress relaxation -40 30Min⇔
110 30MIn
100cycles

Stability
Soldering
Heat

EpinFine2 Heat Stability1
Causes peeling and cracks

EpinFine2 Heat Stability2
Clear under reflow test

EpinFine2 Heat Stability3
Clear under reflow test

Water
Proof
Gas
Barrier

Gas barrier character
(40)g/m2Eday 0.5
vapor permeability cc/m2day
2~5
oxygen gas permeability

Gas barrier character (40)g/m2Eday 0.5
vapor permeability cc/m2day 2~5
oxygen gas permeability

Caused metal corrosion
by water vapor permeability
(40)g/m2Eday 100`150
vapor permeability cc/m2day 2,000~30,000
oxygen gas permeability

Adhesion

PPA/PPA >15Kg/N
Good reliability of adhesion

PPA/PPA >12Kg/N
Good reliability of adhesion

PPA/PPA >5Kg/N
Not much adhesion,
Caused dust attachment
by tack character